In a D2C architecture, a cold plate sits directly atop the heat-generating components (CPUs, GPUs, and high-bandwidth memory). Coolant flows through micro-channels within the plate, absorbing heat, and transports it to a Coolant Distribution Unit (CDU). As Artificial Intelligence (AI) and High-Performance Computing (HPC) workloads drive rack densities beyond 50kW, traditional air cooling is reaching its physical and economic limits. Liquid cooling—specifically Direct-to-Chip (D2C) or Cold Plate technology—has emerged as the standard solution for. Linde Engineering is a technology leader in the assembly of packaged units and coldboxes with over 125 years of experience in cryogenic process plant design. Packaged units - also known as coldboxes - are utilised in a wide range of applications for the treatment of cryogenic fluids and gases. A cold box consists of a carbon steel casing, usually rectangular in shape, that supports and houses heat exchangers, vessels, piping, other related cryogenic equipment, and insulation material in an inert atmosphere. ), the design work is far from over.
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